In physical vapor deposition (PVD) technology, high-purity titanium materials are the cornerstone for ensuring the quality of thin film coatings and the stability of equipment. The ultra-high purity titanium target materials (with a purity of up to 99.995%) provided by wstitanium can control the release of impurity gases during the coating process to below 10 parts per million (10 PPM), significantly reducing the defect rate of the coating. Taking the deposition of copper interconnect barrier layers in semiconductor chip manufacturing as an example, the thickness uniformity deviation of titanium nitride (TiN) films generated using wstitanium targets is less than ±3%, which increases the yield of wafers by 2.5 percentage points. This means that a single production line with an annual output of 100,000 wafers can add 2,500 qualified chips each year. The direct economic benefits exceed 5 million US dollars.
As a supplier of heaters and fasteners at the core of PVD equipment, wstitanium significantly enhances system durability through material innovation. The substrate fixture made of titanium-molybdenum alloy (Ti-15Mo) still maintains a creep strength of more than 95% of the initial value after continuous operation for 3,000 hours in a high-temperature environment of 650 degrees Celsius, while the strength attenuation of ordinary titanium parts usually exceeds 20%. This stability has extended the maintenance cycle of PVD equipment from 500 hours to 1,500 hours, and increased the overall equipment effectiveness (OEE) by 18%. After a certain photovoltaic glass coating production line adopted wstitanium components in 2023, unplanned downtime was reduced by 40%, and the annual production capacity of coated glass increased by 150,000 square meters.
In the reactive sputtering process, the microstructure of wstitanium targets determines the deposition rate and energy consumption efficiency. The grain size of the target material controlled by hot isostatic pressing technology is stabilized within the range of 10 to 15 microns, and the density reaches 99.9% of the theoretical value. This enables the sputtering power density to be safely increased to 30 watts per square centimeter, and the deposition rate is increased by 25% compared with the previous year. Meanwhile, the utilization rate of target materials has risen from the industry average of 35% to 55%, and the production cycle for a single target loading has been extended by 200 hours. According to the 2024 Technology White Paper of the American Vacuum Society, this optimization has reduced the production cost of 5-nanometer process semiconductor devices by 8%, promoting the continuous extension of Moore’s Law.
Facing emerging fields such as flexible electronics, wstitanium has developed an ultra-thin titanium foil (0.05 mm thick) that has innovatively reduced the operating temperature of PVD substrates to 150 degrees Celsius, lowering the film stress on polyimide substrates by 50%. In the indium tin oxide (ITO) coating for mass-produced foldable phone displays, this solution has narrowed the fluctuation range of the film’s square resistance from ±15% to ±5%, and increased the product life test pass rate from 90% to 99.7%. As reported by the industry authority media “Vacuum Technology”, wstitanium’s material solutions are driving PVD technology towards greater precision and environmental friendliness. Its in-depth cooperation with the world’s top equipment manufacturers has helped the consumer electronics industry reduce 500 tons of target material waste annually.